Signal and Power Integrity Engineer in London

Job description

Job Overview:

Are you enthusiastic about new technologies? This position is an excellent opportunity for an experienced and highly motivated Signal and Power Integrity engineer to join the SIPI team and work on the future of System-in-Package designs, focusing on finding the optimum implementations that will improve Arm IP performance.

The semiconductor industry transitioned from multichip modules, then to SoC and is now moving into advanced System-in-Package (SiP) which changes the influence of Arm IP. Arm IP will begin to span multiple pieces of silicon in a system and optimizing this interaction is essential for internal development and enabling partner success. Responsibilities:

The Experienced SIPI engineer will be in charge of creating and analyzing novel System-in-Package designs as well as delivering robust design methodologies and silicon/platform electrical integrity solution spaces. Innovative power delivery techniques and interfaces will be key in emerging technologies as advanced packaging is growing in industry importance. He will need to create or monitor package designs then running specific packaging analysis tools. Senior engineers are expected to play a tech lead role.

The candidate will work closely with teams in UK, France, and other Arm locations on need basis. Candidate must have deep knowledge in interface design and constraints in order to participate in emerging interfaces definition, understand impact on Arm IP, and possibly influence the standard. Clear communication with other team members is important. Candidate may be expected to monitor lab evaluations of the on post-silicon chip, including debugging and solving any possible system level issues.

The job will be based out of San Jose Arm premises. Required Skills and Experience :

Engineering degree or equivalent You hold ideally 5 or more years of experience in System level Signal Integrity with focus on interfaces’ impact on systems. Be very good at working with SIPI analysis environments (Ansys suite, Cadence, or other) Possess good understanding of electromagnetic extraction methodologies and their limitations. Understanding of package drawing to effectively drive a design engineer and perform package drawing modifications tasks on occasional basis. “Nice To Have” Skills and Experience :

Have good understanding SoC implementations and models (IBIS models, power models, impedance profiles of power delivery networks) Experience in System level Power Integrity with focus on package level PI trade-offs. Experienced in complete package design flow from ball map stage up to final tape-out and well versed with all the steps and setup required. Knowledge in packaging manufacturing steps, and their constraints Experience on advanced packaging (2.5D, 3D) Knowledge of Linux environment and scripting (Python, Skill,…) Salary Range:

Staff Engineer:

From: $ 181,900 To: $ 246,100 In Return:

You will work directly with engineers across the company to build next-generation systems. You will have a direct impact on our bottom line and the ability to deliver improvements for our customers. You will be part of a growing, fast-paced, and fun team. You will have ownership for the implementation of your work.

We have a friendly and high-performance working environment, where Arm offers a competitive benefits package including private medical insurance (employee and family), 20-day sabbatical every four years, supplementary pension.

#LI-AC1

Extra information

Status

Closed

Education Level

Secondary School

Location

London

Type of Contract

Full-time jobs

Profession type

Scientific Services

Full UK/EU driving license preferred

No

Car Preferred

No

Must be eligible to work in the EU

No

Cover Letter Required

No

Languages

English