Job description
Our leading Cambridge based semiconductor client is currently searching for a Senior Packaging Engineer to lead the development of advanced semiconductor packaging solutions for high-performance GaN power products. The role will involve driving package design, simulation, and qualification, working closely with internal teams and international partners to deliver differentiated, high-density solutions aligned with the product roadmap. This is a hands-on technical leadership role covering simulation, design, supplier collaboration, qualification, and product support — from concept through to high-volume manufacturing.
Required skills for the Senior Semiconductor Packaging Engineer will include:
- Semiconductor packaging design experience
- 3D multiphysics simulation (COMSOL, ANSYS or similar)
- Semiconductor assembly knowledge (wirebond, flip-chip, embedded)
- Thermal characterisation and reliability testing experience (JEDEC, AEC-Q100)
- Strong communication experience
- Degree qualified
Please contact Rachel Anderson for further details.
Extra information
- Status
- Open
- Education Level
- Secondary School
- Location
- Cambridge
- Type of Contract
- Full-time jobs
- Published at
- 06-03-2026
- Full UK/EU driving license preferred
- No
- Car Preferred
- No
- Must be eligible to work in the EU
- No
- Cover Letter Required
- No
- Languages
- English
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